Skin Effect Archives - EE-Training

Glass Weave for 10+ GBps Stackups

August 16, 2013 by Rolf Ostergaard

With transmission speeds of 10 Gbps, you have to be careful not to have too much line-to-line skew in the differential channels. The glass weave is a big contributor here. When you go to 25 Gbps, this is a MAJOR issue that you NEED to address. Two recent blog posts over on the DesignCon community… Read more

Copper Foil Acronyms for PCB Stackup Design

May 6, 2013 by Rolf Ostergaard

Designing a good stackup starts with understanding the materials. And luckily the materials of a PCB are pretty simple. Glass fiber, epoxy, and copper foil, right? Well, if you follow the discussions about losses due to skin effect, dielectric loss, etc. triggered by the constantly higher signaling speeds required, you will know that the devil… Read more

Rules of thumb for 28 Gbps

October 22, 2012 by Rolf Ostergaard

Rules of thumb are probably not going to cut it anymore for high-speed designs with interfaces like USB 3.0, PCIe 3.0 and other serial links (now approaching 28Gbps on the next generation FPGA’s). So here are some rules of thumb anyways 🙂 This comes from Jim Nadolny of Samtec in this recent webinar moderated by… Read more

Glass Weave for 10+ GBps Stackups

Copper Foil Acronyms for PCB Stackup Design

Rules of thumb for 28 Gbps

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