EE-Training

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Ground vias around signal via

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There has long been a debate going on in the SI community on the need (or not) for ground vias or “stitching vias” near signal vias for high-speed signals. These days you can follow a very interesting and well-behaved debate on the SI-LIST email reflector about just this issue: http://www.freelists.org/post/si-list/AW-Ground-vias-around-signal-via,21 Reading between the lines and… Read more

High Speed Via

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How do you make high-speed vias that work at +56Gpbs? Recently a question came up: How big the clearance hole (anti-pad) needed to be for a through-hole via to have acceptable performance with 56Gbps signals on a high layer count board (22 layers / 2.4mm thickness). I decided to compile all the information I had… Read more