I have recently written about how a memory interposer helps you get better oscilloscope measurements. They do this by embedding what works like the tip of a high frequency probe right into a tiny PCB, that you can solder in between a bigger PCB and a memory chip.
In effect you get to measure as close to the balls of the memory device as practically possible, with a standard memory device package. Something you can do in the lab without the really expensive equipment.
To celebrate the upcoming memory course by Herman Ruckerbauer called “Open the Black Box of Memory” in Stockholm April 13-14 and 15-16, we had a drawing for a “six-pack” of interposers among all who signed up before Mar 15th.
And the winner is:
Ludvig Sjöholm from Husqvarna AB
Congratulations!
Ludvig participates on April 13-14. This course is sold out now, but we still have a few seats left on the following two days (April 15-16) in Stockholm… but you really have to hurry if you want a seat.
Next courses
The next courses coming up are:
SI Week 2015, May 18-22 | Stockholm
Three different courses in one week – combine or pick as you like:
- Lee Ritchey: Signal Integrity (3-day fundamental signal integrity for all design engineers and layouters). Mon-Wed, May 18-20th.
- Simulation: Signal Integrity (1-day hands-on practical simulation of SI issues as presented by Lee Ritchey). Thursday, May 21st.
- Lee Ritchey: Very High Speed (BRAND NEW 1-day course teaching you how to design fast differential links on regular PCB’s up to 32 Gbit/s). Friday, May 22nd.
Eric Bogatin: S-Parameters, June 8-9 | Copenhagen.
Learn practical measurement, analysis and simulation with S-Parameters, which is quickly becoming a fundamental skill for digital design engineers. Learn more and sign up.
Note: The “early bird discount” closes on April 15th, so hurry and save 🙂
PS: If you didn’t win, but still want an interposer, go read all about it and where you can buy some.
M.Sc.EE, SI Consultant